Our background and experience with stencil manufacturing and design systems naturally lead us into BGA stencils and Reballing systems. All BGA stencils are laser cut and electro polished for superior paste release. Stainless steel material is used in conjunction with some composites and PCB materials for system bases.

All manufacturing and design is done in-house. This gives us control of the manufacturing process right up to the final stage, which is shipping to the customer. Our turn time is one to three days.

Customer’s obligation is to supply I-Source with manufacturer’s chip specifications and the chip if possible. Use I-Source's Stencil Order Form.

All orders are reviewed and verified upon receipt. Customer is contacted immediately if any issues arise. Entire engineering staff can deal directly with the customer. Communication channels are open via Voice, Fax, Internet, E-mail and FTP etc.